Zhongke Jinding has developed a new high‑thermal‑conductivity electronic packaging material and is conducting application testing.
2026-02-27 10:39
Recently, the R&D team of Zhongke Jinding (Beijing) New Materials Co., Ltd. has completed New high-thermal-conductivity insulating encapsulation material Laboratory development work. This material has been formulated to optimize both thermal conductivity and electrical insulation, making it suitable for electronic device packaging applications with standard heat‑dissipation requirements.
As the integration level of electronic devices continues to increase, the heat generated during operation must be conducted away through packaging materials. In response to industry‑wide requirements, the technical team at Zhongke Jinding has iteratively optimized the material formulation and, under laboratory conditions, evaluated key performance metrics such as thermal conductivity and dielectric strength.
At present, the product has entered the small‑batch pilot production phase and is undergoing application‑environment testing in collaboration with several electronics companies. Based on the data collected during these tests, the R&D team will continue to refine and optimize the product’s formulation and manufacturing processes.
Recommended News
Phone:
+86 18002016279
3992495276@qq.com
Address:
No. 1, Juhe Sixth Street, Jufuyuan Industrial Park, Economic Development Zone, Tongzhou District, Beijing – 6638
If you are interested in our products, please leave us a message online.
*Please fill in your information accurately; our staff will contact you as soon as possible.