Apexazole® AU Series PBI

The Apexazole®AU product series effortlessly handles a wide range of extremely demanding operating conditions and is widely suited to high-end industries such as oilfields, aerospace, and semiconductors. Components manufactured from this polymer series can withstand harsh environments that conventional engineering plastics cannot endure, and under extreme conditions, their overall performance consistently outperforms that of high-performance materials like polyimide, polyamide‑imide, and polyether ether ketone.

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Product Details

Apexazole® AU series PBI exhibits outstanding mechanical strength and thermal stability.

The Apexazole®AU product series effortlessly handles a wide range of extremely demanding operating conditions and is widely suited to high-end industries such as oilfields, aerospace, and semiconductors. Components manufactured from this polymer series can withstand harsh environments that conventional engineering plastics cannot endure, and under extreme conditions, their overall performance surpasses that of high-performance materials like polyimide, polyimide‑amide, and polyether ether ketone.

Product Specifications

Apexazole® AU Series PBI Product Classification

Product	Type	Key Features	Main application scenarios
AU-60	Unfilled pure PBI	Among unfilled thermoplastics, it exhibits the highest compressive strength (393 MPa), tensile strength of 158 MPa, a glass transition temperature (Tg) of 427°C, is non‑flammable, and demonstrates exceptional resistance to chemical corrosion.	Industrial precision components, semiconductors/liquid crystal displays, aerospace, valve seals for the petrochemical industry, fiberglass wire-drawing guide rails, fire protection
AU-60SD	Semiconductor-grade high-purity PBI	Ultra-low metal ion content (in the ppb range), excellent plasma resistance, extremely low risk of metal leaching, and good thermal stability.	Dry Etch equipment, CVD/PVD deposition chambers, wafer-handling components, and advanced-process internal parts
AU-60ESD	Electrostatic-dissipative PBI	Carbon fiber modification enables customizable ESD properties—ranging from standard to highly conductive—while delivering both high-temperature resistance and electrostatic dissipation.	Electrostatic chuck (wafer holder), wafer carrier, CMP polishing carrier, electrostatic‑sensitive device processing fixture
AU-60CF	30% carbon fiber-reinforced PBI	Tensile strength: 248 MPa; flexural strength: 290 MPa; compressive strength: 448 MPa—highest among comparable materials. It is electrically conductive (surface resistivity: 10¹–10³ Ω/sq) and exhibits excellent high-temperature and wear resistance.	High-strength structural components, wear-resistant plates and sealed bearings for semiconductors, rocket nozzle throat liners, plasma‑environment components, and high‑temperature bearing cages.

Apexazole® AU Series PBI Product Performance Data

Parameter	AU-60 (Pure PBI)	AU-60SD (High Purity)	AU-60ESD (ESD model)	AU-60CF (30% CF)
Tensile strength	158 MPa	158 MPa	158 MPa	248 MPa
Flexural strength	—	—	—	290 MPa
Compressive strength	393 MPa (maximum)	Quite	Quite	448 MPa
Tensile modulus	6-7 GPa	6-7 GPa	—	12 GPa
Glass transition temperature	427°C	427°C	427°C	427°C
Surface resistivity	10¹⁶ Ω/sq (insulating)	Quite	10⁵–10⁹ Ω/sq (ESD adjustable)	10¹–10³ Ω/sq (conductive)
Features	Optimal overall performance	Ultra-low metal contamination	ESD customization is flexible.	Dual excellence in strength and conductivity

Apexazole® AU Series PBI Product Selection Guide

Operating Condition Requirements	Recommended grade
General-purpose high-temperature structure / Highest compressive strength	AU-60
Semiconductor plasma processing (to prevent metal contamination)	AU-60SD
Wafer electrostatic chucking / ESD-sensitive processes	AU-60ESD
High-load structural components / Wear-resistant / High-temperature bearings	AU-60CF